Electronic module with a conductive-pattern layer and a method of manufacturing same

ABSTRACT

This publication discloses an electronic module and a method for manufacturing an electronic module, in which a component ( 6 ) is glued ( 5 ) to the surface of a conductive layer, from which conductive layer conductive patterns ( 14 ) are later formed. After gluing the component ( 6 ), an insulating-material layer ( 1 ), which surrounds the component ( 6 ) attached to the conductive layer, is formed on, or attached to the surface of the conductive layer. After the gluing of the component ( 6 ), feed-throughs are also made, through which electrical contacts can be made between the conductive layer and the contact zones ( 7 ) of the component. After this, conductive patterns ( 14 ) are made from the conductive layer, to the surface of which the component ( 6 ) is glued.

The present invention relates to an electronic module and a method formanufacturing an electronic module.

In particular, the invention relates to an electronic module, whichincludes one or more components embedded in an installation base. Theelectronic module can be a module like a circuit board, which includesseveral components, which are connected to each other electrically,through conducting structures manufactured in the module. The componentscan be passive components, microcircuits, semiconductor components, orother similar components. Components that are typically connected to acircuit board form one group of components. Another important group ofcomponents are components that are typically packaged for connection toa circuit board. The electronic modules to which the invention relatescan, of course, also include other types of components.

The installation base can be of a type similar to the bases that aregenerally used in the electronics industry as installation bases forelectrical components. The task of the base is to provide componentswith a mechanical attachment base and the necessary electricalconnections to both components that are on the base and those that areoutside the base. The installation base can be a circuit board, in whichcase the construction and method to which the invention relates areclosely related to the manufacturing technology of circuit boards. Theinstallation base may also be some other base, for example, a base usedin the packaging of a component or components, or a base for an entirefunctional module.

The manufacturing techniques used for circuit boards differ from thoseused for microcircuits in, among other things, the fact that theinstallation base in microcircuit manufacturing techniques, i.e. thesubstrate, is of a semiconductor material, whereas the base material ofan installation base for circuit boards is some form of insulatingmaterial. The manufacturing techniques for microcircuits are alsotypically considerably more expensive that the manufacturing techniquesfor circuit boards.

The constructions and manufacturing techniques for the cases andpackages of components, and particularly semiconductor components differfrom the construction and manufacture of circuit boards, in thatcomponent packaging is primarily intended to form a casing around thecomponent, which will protect the component mechanically and facilitatethe handling of the component. On the surface of the component, thereare connector parts, typically protrusions, which allow the packagedcomponent to be easily set in the correct position on the circuit boardand the desired connections to be made to it. In addition, inside thecomponent case, there are conductors, which connect the connector partsoutside the case to connection zones on the surface of the actualcomponent, and through which the component can be connected as desiredto its surroundings.

However, component cases manufactured using conventional technologydemand a considerable amount of space. As electronic devices have grownsmaller, there has been a trend to eliminate component cases, which takeup space, are not essential, and create unnecessary costs. Variousconstructions and methods have been developed to solve this problem.

One known solution is flip-chip (FC) technology, in which non-packagedsemiconductor components are installed and connected directly to thesurface of the circuit board. However, flip-chip technology has manyweaknesses and difficulties. For example, the reliability of theconnections can be a problem, especially in applications, in whichmechanical stresses arise between the circuit board and thesemiconductor component. In an attempt to avoid mechanical stresses, asuitable elastic underfill, which equalizes mechanical stresses, isadded between the semiconductor component and the circuit board. Thisprocedural stage slows down the manufacturing process and increasescosts. Even the thermal expansion caused by the normal operation of adevice may cause mechanical stresses large enough to compromise thelong-term reliability of an FC structure.

U.S. Pat. No. 4,246,595 discloses one solution, in which recesses areformed in the installation base for the components. The bottoms of therecesses are bordered by a two-layered insulation layer, in which holesare made for the connections of the component. The layer of theinsulation layer that lies against the components is made of anadhesive. After this, the components are embedded in the recesses withtheir connection zones facing the bottom of the recess, electricalcontacts being formed to the components through the holes in theinsulation layer. If it is wished to make the structure mechanicallydurable, the component must also be attached to an installation base, sothat the method is quite complicated. It is extremely difficult to use acomplicated method, which demands several different materials andprocess stages, to profitably manufacture cheap products. In other waystoo, the method does not correspond to the technology used nowadays (thepatent dates from 1981).

JP application publication 2001-53 447 discloses a second solution, inwhich a recess is made for the component in an installation base. Thecomponent is placed in the recess, with the component's contact zonesfacing towards the surface of the installation base. Next, an insulationlayer is made on the surface of the installation base and over thecomponent. Contact openings for the component are made in the insulationlayer and electrical contacts are made to the component, through thecontact openings. In this method, considerable accuracy is demanded inmanufacturing the recess and setting the component in the recess, sothat the component will be correctly positioned, to ensure the successof the feed-throughs, relative to the width and thickness of theinstallation board.

The invention is intended to create a relatively simple and economicalmethod for manufacturing electronic modules, with the aid of which amechanically durable construction can be achieved.

The invention is based on the component being glued to the surface of aconductive layer, from which conductive layer conductive patterns arelater formed. After the gluing of the component, an insulating-materiallayer, which surrounds the component attached to the conductive layer,is formed on, or attached to the surface of the conductive layer. Afterthe gluing of the component, feed-throughs are also made, through whichelectrical contacts can be formed between the conductive layer and theconductive zones of the component. After this, conductive patterns areformed from the conductive layer, to which the component is glued.

More specifically, the method according to the invention ischaracterized by what is stated in Claim 1.

One electronic module application according to the invention is, inturn, characterized by what is stated in Claim 19.

Considerable advantages are gained with the aid of the invention. Thisbecause it is possible, with the aid of the invention, to manufacturemechanically durable electronic modules, which include unpackagedcomponents embedded in an installation base.

The invention permits a quite simple manufacturing method, in whichrelatively few different materials are required. For this reason, theinvention has embodiments, with the aid of which electronic modules canbe manufactured at low cost. For example, in the technique disclosed inU.S. Pat. No. 4,246,595, (the references are to FIG. 8 of the patent) asupport layer 24, an insulating layer 16, and an adhesion layer 17 arerequired. In addition, a fourth insulating material (not shown in theembodiment of FIG. 8), i.e. filler with the aid of which the componentis attached to the support layer 24, is also required, in order tocreate a mechanically sturdy attachment. In the solution of the JPapplication publication 2001-53 447 too, a corresponding attachment thatentirely surrounds the component requires about 3-4 separate insulatingmaterials, or insulating layers (publication FIGS. 2 and 4).

Unlike the reference publications, our invention has embodiments, inwhich the component can be entirely surrounded using 2-3 insulatingmaterials, or insulating layers. This because the contact surface of thecomponent is glued to a conductive layer, so that, in preferredembodiments, the adhesive attaches the component essentially over theentire area of its contact surface. Elsewhere, in such an embodiment,the component is attached with the aid of an insulating-material layer,which acts as the base material for the electronic module being formed.The insulating-material layer is formed after the gluing of thecomponent, so that in preferred embodiments it can be made around thecomponent to conform to the shape of the component. In such embodiments,it is possible to achieve a comprehensive attachment of the componentwith the aid of an adhesive layer and a base-material layer formed from1-2 insulating-material sheets.

In the embodiments of the invention, it is thus possible to manufacturea circuit board, inside which components are embedded. The inventionalso has embodiments, with the aid of which a small and reliablecomponent package can be manufactured around a component, as part of thecircuit board. In such an embodiment, the manufacturing process issimpler and cheaper than manufacturing methods in which separatepackaged components are installed and connected to the surface of thecircuit board. The manufacturing method can also be applied to use themethod to manufacture Reel-to-Reel products. Thin and cheapcircuit-board products containing components can be made by using themethods according to the preferred embodiments.

The invention also permits many other preferred embodiments, which canbe used to obtain significant additional advantages. With the aid ofsuch embodiments, a component's packaging stage, the circuit board'smanufacturing stage, and the assembly and connecting stage of thecomponents, for example, can be combined to form a single totality. Thecombination of the separate process stages brings significant logisticaladvantages and permits the manufacture of small and reliable electronicmodules. A further additional advantage is that such anelectronic-module manufacturing method can mostly utilize knowncircuit-board manufacturing and assembly techniques.

The composite process according to the embodiment referred to above is,as a totality, simpler than manufacturing a circuit board and attachinga component to the circuit board using, for example, the flip-chiptechnique. By using such preferred embodiments, the following advantagesare obtained, compared to other manufacturing methods:

-   -   Soldering is not needed in the connections of the components,        instead an electrical connection between the connection zones on        the surface of the component and the metal film of the        installation base is created by a via-method. This means that        the connection of a component does not need metal being        maintained molten for a long time with its associated high        temperature. Thus, the construction is made more reliable than        soldered connections. The brittleness of the metal alloys        creates large problems particularly in small connections. In a        solderless solution according to a preferred embodiment, it is        possible to achieve clearly smaller constructions than in        soldered solutions.    -   As smaller structures can be manufactured using the method, the        components can be placed closer together. Thus, the conductors        between the components also become shorter and the        characteristics of the electronic circuits improve. For example,        losses, interferences, and transit-time delays can be        significantly reduced.    -   The method permits a lead-free manufacturing process, which is        environmentally friendly.    -   When using a solderless manufacturing process, fewer undesirable        intermetallics also arise, thus improving the long-term        reliability of the construction.    -   The method also permits three-dimensional structures to be        manufactured, as the installation bases and the components        embedded in them can be stacked on top of each other.

The invention also permits other preferred embodiments. For instance,flexible circuit boards can be used in connection with the invention.Further, in embodiments, in which the temperature of the installationbase can be kept low during the entire process, organic manufacturingmaterials can be used comprehensively.

With the aid of embodiments, it is also possible to manufactureextremely thin structures, in which, despite the thinness of thestructure, the components are entirely protected inside theirinstallation base, such as a circuit board.

In embodiments, in which the components are located entirely inside theinstallation base, the connections between the circuit board and thecomponents will be mechanically durable and reliable.

The embodiments also permit the design of electronic-modulemanufacturing processes requiring relatively few process stages.Embodiments with fewer process stages correspondingly also require fewerprocess devices and various manufacturing methods. With the aid of suchembodiments, it is also possible in many cases to cut manufacturingcosts compared to more complicated processes.

The number of conductive-pattern layers of the electronic module canalso be chosen according to the embodiment. For example, there can beone or two conductive-pattern layers. Additional conductive-patternlayers can be manufactured on top of these, in the manner known in thecircuit-board industry. A total module can thus incorporate, forexample, three, four, or five conductive-pattern layers. The verysimplest embodiments have only one conductive-pattern layer and indeedone conductor layer. In some embodiments, each of the conductor layerscontained in the electronic module can be exploited when formingconductive patterns.

In embodiments, in which the conductor layer connected to a component ispatterned only after the connection of the component, the conductorlayer can include conductor patterns even at the location of thecomponent. A corresponding advantage can also be achieved inembodiments, in which the electronic module is equipped with a secondconductive-pattern layer, which is located on the opposite surface ofthe base material of the module (on the opposite surface of theinsulation material layer relative to the conductive-pattern layerconnected to the component). The second conductor layer can thus alsoinclude conductive patterns at the location of the component. Theplacing of conductive patterns in the conductor layers at the locationof the component will permit a more efficient use of space in the moduleand a denser structure.

In the following, the invention is examined with the aid of examples andwith reference to the accompanying drawings.

FIGS. 1-10 show a series of cross-sections of some examples ofmanufacturing methods according to the invention and schematiccross-sectional diagrams of some electronic modules according to theinvention.

FIG. 11 shows a cross-sectional view of one electronic module accordingto the invention, which includes several installation bases on top ofeach other.

In the methods of the examples, manufacturing starts from a conductivelayer 4, which can be, for example, a metal layer. One suitablemanufacturing material for the conductive layer 4 is copper film (Cu).If the conductive film 4 selected for the process is very thin, or theconductive film is not mechanically durable for other reasons, it isrecommended that the conductive film 4 be supported with the aid of asupport layer 12. This procedure can be used, for example, in such a waythat the process is started from the manufacture of the support layer12. This support layer 12 can, for example, an electrically conductivematerial, such as aluminium (Al), steel, or copper, or an insulatingmaterial, such as a polymer. An unpatterned conductive layer 4 can bemade on the second surface of the support layer 4, for example, by usingsome manufacturing method well known in the circuit-board industry. Theconductive layer can be manufactured, for example, by laminating acopper film (Cu) on the surface of the support layer 12. Alternatively,it is possible to proceed by making the support layer 12 on the surfaceof the conductive layer 4. The conductive film 4 can also be a surfacedmetal film, or some other film including several layers, or severalmaterials.

Later in the process, conductive patterns are made from the conductivelayer 4. The conductive patterns must then be aligned relative to thecomponents 6. The alignment is most easily performed with the aid ofsuitable alignment marks, at least some of which can be made already inthis stage of the process. Several different methods are available forcreating the actual alignment marks. One possible method is to makesmall through-holes 3 in the conductive layer 4, in the vicinity of theinstallation areas of the components 6. The same through-holes 3 canalso be used to align the components 6 and the insulating-material layer1. There should preferably be at least two through-holes 3, for thealignment to be carried out accurately.

The components 6 are attached to the surface of the insulating layer 4with the aid of an adhesive. For gluing, an adhesive layer 5 is spreadon the attachment surface of the conductive layer 4, or on theattachment surface of the component 6, or on both. After this, thecomponents 6 can be aligned to the positions planned for the components6, with the aid of alignment holes 3, or other alignment marks.Alternatively, it is possible to proceed by first gluing the componentsto the conductive layer 4, positioned relative to each other, and afterthis making the alignment marks aligned relative to the components. Theterm attachment surface of the component 6 refers to that surface, whichfaces the conductive layer 4. The attachment surface of the component 6includes the contact zones, by means of which an electrical contact canbe formed with the component. Thus, the contact zones can be, forexample, flat areas on the surface of the component 6, or more usuallycontact protrusions protruding from the surface of the component 6.There are generally at least two contact zones or protrusions in thecomponent 6. In complex microcircuits, there can be a greater number ofcontact zones.

In many embodiments, it is preferable to spread so much adhesive on theattachment surface, or attachment surfaces, that the adhesive entirelyfills the space remaining between the components 6 and the conductivelayer 4. A separate filler is then not required. The filling of thespace between the components 6 and the conductive layer 4 reinforces themechanical connection between the component 6 and the conductive layer4, thus achieving a structure that is mechanically more durable. Thecomprehensive and unbroken adhesive layer also supports the conductivepatterns 14 to be formed later from the conducting layer 4 and protectsthe structure during later process stages.

The term adhesive refers to a material, by means of which the componentscan be attached to the conductive layer. One property of the adhesive isthat the adhesive can be spread on the surface of the conductive layer,and/or of the component in a relatively fluid form, or otherwise in aform that will conform to the shape of the surface. Another property ofthe adhesive is that, after spreading, the adhesive hardens, or can behardened, at least partly, so that the adhesive will be able to hold thecomponent in place (relative to the conductive layer), at least untilthe component is secured to the structure in some other manner. A thirdproperty of the adhesive is its adhesive ability, i.e. its ability tostick to the surface being glued.

The term gluing refers to the attachment of the component and conductivelayer to each other with the aid of an adhesive. Thus, in gluing, anadhesive is brought between the component and the conductive layer andthe component is placed in a suitable position relative to theconductive layer, in which the adhesive is in contact with the componentand the conductive layer and at least partly fills the space between thecomponent and the conductive layer. After this, the adhesive is allowed(at least partly) to harden, or the adhesive is actively hardened (atleast partly), so that the component sticks to the conductive layer withthe aid of the adhesive. In some embodiments, the contact protrusions ofthe component may, during gluing, extend through the adhesive layer tomake contact with the conductive layer.

The adhesive used in the embodiments is typically a thermally hardeningepoxy, for example an NCA (non-conductive adhesive). The adhesive isselected to ensure that the adhesive used will have sufficient adhesionto the conductive film, the circuit board, and the component. Onepreferred property of the adhesive is a suitable coefficient of thermalexpansion, so that the thermal expansion of the adhesive will not differtoo greatly from the thermal expansion of the surrounding materialduring the process. The adhesive selected should also preferably have ashort hardening time, preferably of a few seconds at most. Within thistime, the adhesive should harden at least partly, to such an extent thatthe adhesive is able to hold the component in position. Final hardeningcan take clearly more time and the final hardening can be planned totake place in connection with later process stages. The adhesive shouldalso withstand the process temperatures used, for example, heating to atemperature in the range 100-265° C. a few times, and other stresses inthe manufacturing process, for example, chemical and mechanical stress.The electrical conductivity of the adhesive is preferably in the sameorder as that of the insulating materials.

A suitable insulating-material layer 1 is selected as the base materialof the electronic module, for example, the circuit board. Using asuitable method, recesses, or through-holes are made in theinsulating-material layer 1, according to the size and mutual positionsof the components 6 to be attached to the conductive layer 4. Therecesses or through-holes can also be made to be slightly larger thanthe components 6, in which case the alignment of the insulating layer 1relative to the conductive layer 4 will not be so critical. If aninsulating-material layer 1, in which through-holes are made for thecomponents 6, is used in the process, certain advantages can be achievedby using, in addition, a separate insulating-material layer 11, in whichholes are not made. Such an insulating-material layer 11 can be locatedon top of the insulating-material layer 1 to cover the through-holesmade for the components.

If it is desired to make a second conductive layer in the electronicmodule, this can be made, for example, on the surface of theinsulating-material layer 1. In embodiments, in which a secondconductive layer 11 is used, the conductive layer can be made on thesurface of this second conductive layer 11. If desired, conductivepatterns 19 can be made from a second conductive layer 9. The conductivelayer 9 can be made, for example, in a corresponding manner to theconductive film 4. The manufacture of a second conductive film 9 is not,however, necessary in simple embodiments and when manufacturing simpleelectronic modules. A second conductive film 9 can, however, beexploited in many ways, such as additional space for conductive patternsand to protect the components 6 and the entire module againstelectromagnetic radiation (EMC shielding). With the aid of a secondconductive film 9 the structure can be reinforced and warping of theinstallation base, for example, can be reduced.

Feed-throughs, through which electrical contacts can be formed betweenthe contact zones of the components 6 and the conductive layer 4, aremade in the electronic module. Holes 17 are made in the conductive layer4 for the feed-throughs, at the positions of the contact zones (in thefigures, the contact protrusions 7) of the components 6. Holes 3, orother available alignment marks can be utilized in the alignment. Theholes 17 are made in such a way that they also penetrate through theadhesive layer that has been left on top of the contact zones, orcontact protrusions 7. The holes 17 thus extend to the material of thecontact protrusions 7 or other contact zones. The holes 17 can be made,for example, by drilling with a laser device, or by using some othersuitable method. After this, conductive material is introduced to thehole 17, so that an electrical contact is formed between the components6 and the conductive layer 4.

The manufacturing processes according to the examples can be implementedusing manufacturing methods, which are generally known to those versedin the art of manufacturing circuit boards.

In the following, the stages of the method shown in FIGS. 1-8 areexamined in greater detail.

Stage A (FIG. 1):

In stage A, a suitable conductive layer 4 is selected as the initialmaterial of the process. A layered sheet, in which the conductive layer4 is located on the surface of a support base 12, can also be selectedas the initial material. The layered sheet can be manufactured, forexample, in such a way that a suitable support base 12 is taken forprocessing, and a suitable conductive film for forming the conductivelayer 4 is attached to the surface of this support base 12.

The support base 12 can be made of, for example, an electricallyconductive material, such as aluminium (Al), or an insulating material,such as polymer. The conductive layer 4 can be formed, for example, byattaching a thin metal film to the second surface of the support base12, for example, by laminating it from copper (Cu). The metal film canbe attached to the support base, for example, using an adhesive layer,which is spread on the surface of the support base 12 or metal filmprior to the lamination of the metal layer. At this stage, there neednot be any patterns in the metal film.

In the example of FIG. 1, holes 3 are made penetrating the support base12 and the conductive layer 4, for alignment during the installation andconnection of the components 6. Two through-holes 3, for example, can bemanufactured for each component 6 to be installed. The holes 3 can bemade using some suitable method, for example, mechanically by milling,impact, drilling, or with the aid of a laser. However, it is notessential to make through-holes 3, instead some other suitable alignmentmarkings can be used to align the components. In the embodiment shown inFIG. 1, the through-holes 3 used to align the components extend throughboth the support base 12 and the conductive film 4. This has theadvantage that the same alignment marks (through-holes 3) can be usedfor aligning on both sides of the installation base.

Stage A can also be performed in the same way in embodiments in which aself-supporting conductive layer 4 is used and from which thus totallylacks a support layer 12.

Stage B (FIG. 2):

In stage B, an adhesive layer 5 is spread on those areas of theconductive layer 4, to which the components 6 will be attached. Theseareas can be termed attachment areas. The adhesive layers 5 can bealigned, for example, with the aid of the through-holes 3. The thicknessof the adhesive layer is selected so that the adhesive suitably fillsthe space between the component 6 and the conductive layer 4, when thecomponent 6 is pressed onto the adhesive layer 5. If the component 6includes contact protrusions 7, it would be good for the thickness ofthe adhesive layer 5 to be greater, for example about 1.5-10 times, theheight of the contact protrusions 7, so that the space between thecomponent 6 and the conductive layer 4 will be properly filled. Thesurface area of the adhesive layer 5 formed for the component 6 can alsobe slightly larger than the corresponding surface area of the component6, which will also help to avoid the risk of inadequate filling.

Stage B can be modified in such a way that the adhesive layer 5 isspread on the attachment surfaces of the components 6, instead of on theattachment areas of the conductive layer 4. This can be carried out, forexample, by dipping the component in adhesive, prior to setting it inplace in electronic module. It is also possible to proceed by spreadingthe adhesive on both the attachment areas of the conductive layer 4 andon the attachment surfaces of the components 6.

The adhesive being used is thus a electrical insulator, so thatelectrical contacts are not formed in the actual adhesive layer 5,between the contact zones (contact protrusions 7 in the example) of thecomponent 6.

Stage C (FIG. 3):

In stage C, the component 6 is set in place in the electronic module.This can be done, for example, by pressing the components 6 into theadhesive layer 5, with the aid of an assembly machine. In the assemblystage, the through-holes 3 made for alignment, or other availablealignment marks, are used to align the components 6.

The components 6 can be glued individually, or in suitable groups. Thetypical procedure is for the conductive layer, which can be termed thebottom of the installation base, to be brought to a suitable positionrelative to the assembly machine, and after this the component 6 isaligned and pressed onto the bottom of the installation base, which isheld stationary during the aligning and attaching.

Stage D (FIG. 4):

In stage D, an insulating-material layer 1, in which there arepre-formed recesses 2 or recesses for the components 6 to be glued tothe conductive layer 4, is placed on top of the conductive layer 4. Theinsulating-material layer 1 can be made from a suitable polymer base, inwhich recesses or cavities according to the size and position of thecomponents 6 are made using some suitable method. The polymer made canbe, for example, a pre-preg base known and widely used in thecircuit-board industry, which is made from a glass-fibre mat andso-called b-state epoxy. It is best to perform stage D only once theadhesive layer 5 has been hardened, or it has otherwise hardenedsufficiently for the components 6 to remain in place during the placingof the insulating-material layer 1.

When manufacturing a very simple electronic module, theinsulating-material layer 1 can be attached to the conductive layer 4 inconnection with stage D and the process continued with the patterning ofthe conductive layer 4.

Stage E (FIG. 5):

In stage E, an unpatterned insulating-material layer 11 is placed on topof the insulating-material layer 1 and on top of it a conductive layer9. Like the insulating-material layer 1, the insulating-material layer11 can be made from a suitable polymer film, for example, the aforesaidpre-preg base. The conductive layer 9 can, in turn, be, for example, acopper film, or some other film suitable for the purpose.

Stage F (FIG. 6):

In stage F, the layers 1, 11, and 9 are pressed with the aid of heat andpressure in such a way that the polymer (in the layers 1 and 11) forms aunified and tight layer between the conductive layer 4 and 9 around thecomponents 6. The use of this procedure makes the second conductivelayer 9 quite smooth and even.

When manufacturing simple electronic modules and those including asingle conductive-pattern layer 14, stage E can even be totally omitted,or the layers 1 and 11 can be laminated to the construction, without aconductive layer 9.

Stage G (FIG. 7):

In stage G, the support base 12 is detached or otherwise removed fromthe construction. Removal can take place, for example, mechanically orby etching. Stage G can naturally be omitted from embodiments that donot employ a support base 12.

Stage H (FIG. 8):

In stage H, holes 17 are made for the feed-throughs. The holes 17 aremade through the conductive layer 4 and the adhesive layer 5, in such away that the material of the contact protrusions 7, or other contactzones of the components 6 is exposed. The holes 17 can be made, forexample, by drilling with a laser. The holes 17 can be aligned, forexample, with the aid of holes 3.

Stage I (FIG. 9):

In stage I, conductive material 18 is grown into the holes 17 made instage H. In the example process, the conductive material is grown at thesame time also elsewhere on top of the base, so that the thickness ofthe conductive layers 4 and 9 also increases.

The conductive material 18 being grown can be, for example, copper, orsome other sufficiently electrically conductive material. The choice ofconductive material 18 should take into account the ability of thematerial to form an electrical contact with the contact protrusions 7 ofthe component 6. In one example process, the conductive material ismainly copper. Copper-metallizing can be performed by surfacing theholes 17 with a thin layer of chemical copper and then continuing thesurfacing using an electrochemical copper-growing method. Chemicalcopper is used, for example, because it also forms a surface on top ofthe adhesive and acts as an electrical conductor in electrochemicalsurfacing. The growth of the metal can thus be performed using awet-chemical method, in which case the growing will be cheap.

In the example process, the holes 17 of the feed-throughs are firstcleaned using a three-stage desmear treatment. After this, thefeed-throughs are metallized in such a way that an SnPd coatingcatalysing the polymer is first formed, after which a thin layer (about2 μm) is deposited on the surface. The thickness of the copper isincreased using electrochemical deposition.

Stage I is intended to form an electrical contact between the component6 and the conductive layer 4. In stage I, it is therefore not essentialto increase the thickness of the conductive layers 4 and 9, instead theprocess can equally well be planned in such a way that in stage I theholes 17 are only filled with a suitable material. The conductive layer18 can be made, for example, by filling the holes 17 with anelectrically conductive paste, or by using some other metallizing methodsuitable for micro-vias.

In the later figures, the conductive layer 18 is shown with theconductive layers 4 and 9 merged.

Stage J (FIG. 10):

In stage J, the desired conductive patterns 14 and 19 are formed fromthe conductive layers 4 and 9 on the surface of the base. If only asingle conductive layer 4 is used in the embodiment, the patterns areformed on only one side of the base. It is also possible to proceed insuch a way that the conductive patterns are only formed from theconductive layer 4, even though a second layer 9 is also used in theembodiment. In such an embodiment, the unpatterned conductive layer 9can act, for example, as a mechanically supporting or protective layerof the electronic module, or as a protection against electromagneticradiation.

The conductive patterns 14 can be made, for instance, by removing theconductive material of the conductive layer 4 from outside of theconductive patterns. The conductive material can be removed, forexample, using one of the patterning and etching methods that are widelyused and well known in the circuit-board industry.

After stage J, the electronic module includes a component 6, or severalcomponents 6 and conductive patterns 14 and 19 (in some embodiments onlyconductive patterns 14), with the aid of which the component orcomponents 6 can be connected to an external circuit, or to each other.The conditions for manufacturing a functional totality then existalready. The process can thus be designed in such a way that theelectronic module is already finished after stage J and FIG. 10 showsone example of a possible electronic module that can be manufacturedusing the example methods. If it is wished, the process can alsocontinue after stage J, for example, by surfacing the electronic modulewith a protective substance, or by making additional conductive patternson the first and/or second surface of the electronic module.

FIG. 11

FIG. 11 shows a multi-layered electronic module, which includes threebases 1 laminated on top of each other, together with their components6, and a total of six conductive-pattern layers 14 and 19. The bases 1are attached to each other with the aid of intermediate layers 32. Theintermediate layer 32 can be, for example, a pre-preg epoxy layer, whichis laminated between the installation bases 1. After this, holes runningthrough the module are drilled in the electronic module, in order toform contacts. The contacts are formed with the aid of a conductivelayer 31 grown in the holes. With the aid of the conducts 31 runningthrough the electronic module, the various conductive-pattern layers 14and 19 of the installation bases 1 can be suitably connected to eachother, thus forming a multi-layered functioning totality.

On the basis of the example of FIG. 11, it is clear that the method canalso be used to manufacture many different kinds of three-dimensionalcircuit structures. The method can be used, for example, in such a waythat several memory circuits are placed on top of each other, thusforming a package containing several memory circuits, in which thememory circuits are connected to each other to form a single functionaltotality. Such packages can be termed three-dimensional multichipmodules. In modules of this kind, the chips can be selected freely andthe contacts between the various chips can be easily manufacturedaccording to the selected circuits.

The sub-modules (bases 1 with their components 6 and conductors 14 and19) of a multi-layered electronic module can be manufactured, forexample, using one of the electronic-module manufacturing methodsdescribed above. Some of the sub-modules to be connection to the layeredconstruction can, of course, be quite as easily manufactured using someother method suitable for the purpose.

The examples of FIGS. 1-11 show some possible processes, with the aid ofwhich our invention can be exploited. Our invention is not, however,restricted to only the processes disclosed above, but instead theinvention also encompasses various other processes and their endproducts, taking into account the full scope of the Claims and theinterpretation of their equivalences. The invention is also notrestricted to only the constructions and method described by theexamples, it being instead obvious to one versed in the art that variousapplications of our invention can be used to manufacture a wide range ofdifferent electronic modules and circuit boards, which differ greatlyfrom the examples described above. Thus, the components and wiring ofthe figures are shown only with the intention of illustrating themanufacturing process. Thus many alterations to and deviations from theprocesses of the examples shown above can be made, while neverthelessremaining within the basic idea according to the invention. Thealterations can relate, for example, to the manufacturing techniquesdescribed in the different stages, or to the mutual sequence of theprocess stages.

With the aid of the method, it is also possible to manufacture componentpackages for connection to a circuit board. Such packages can alsoinclude several components that are connected electrically to eachother.

The method can also be used to manufacture total electrical modules. Themodule can also be a circuit board, to the outer surface of whichcomponents can be attached, in the same way as to a conventional circuitboard.

1. An electronic module, the module comprising: an insulating-materiallayer, which has a first surface and a second surface; at least one holeor recess in the insulating-material layer, which opens out onto thefirst surface; at least one component inside the at least one hole orrecess, wherein the component includes contact zones on the side of thecomponent that faces the first surface of the insulating-material layer,and further wherein the component is positioned in such a way that thecontact zones are located at a specified distance from the level of thefirst surface of the insulating-material layer; a conductive-patternlayer, which runs on the first surface of the insulating-material layerand extends on top of the at least one hole or recess in theinsulating-material layer and at the location of the contact zones ofthe components; a hardened adhesive layer in the hole or recess in theinsulating-material layer, between the component and theconductive-pattern layer; and an electrical contact area between theconductive-pattern layer and the contact zones of the component, wheresaid contact area is formed by conductive-material formationspenetrating the adhesive layer.
 2. The electronic module according toclaim 1, wherein the thickness of the component is less than thethickness of the insulating-material layer in the direction between thefirst surface and the second surface of the insulating-material layer.3. The electronic module according to claim 1, wherein theconductive-pattern layer is substantially flat, so that the surface ofthe conductive-pattern layer that lies against the insulating-materiallayer, and the hole or recess in the insulating-material layer for thecomponent, is located entirely at substantially the level of the firstsurface of the insulating-material layer.
 4. The electronic moduleaccording to claim 1, further comprising a second conductive-patternlayer, which runs on the second surface of the insulating-materiallayer.
 5. The electronic module according to claim 1, further comprisingseveral components connected electrically to each other by conductivepatterns, such that the components form a functional totality.
 6. Theelectronic module according to claim 4, wherein the insulating-materiallayer is a unified and tight layer of polymer between theconductive-pattern layer and the second conductive-pattern layer andaround the at least one component.
 7. The electronic module according toclaim 6, wherein the polymer is epoxy.
 8. The electronic moduleaccording to claim 7, wherein the insulating-material layer includes atleast one layer of glass-fibres inside the layer of epoxy.
 9. Theelectronic module according to claim 8, wherein at least one of said atleast one layer of glass-fibres comprises a hole made for the at leastone component.
 10. The electronic module according to claim 8, whereinat least one of said at least one layer of glass-fibres extends betweenthe at least one component and the second conductive-pattern layer. 11.The electronic module according to claim 1, wherein theinsulating-material layer comprises at least one glass-fibre mat and alayer of epoxy tightly surrounding said at least one component and saidat least one glass-fibre mat.
 12. The electronic module according toclaim 1, wherein the insulating-material layer comprises epoxy and atleast one glass-fibre mat having at least one hole for the at least onecomponent.
 13. The electronic module according to claim 12, wherein theat least one component is located in the at least one hole in theglass-fibre mat and the epoxy fills the at least one hole in theglass-fibre mat around the component.
 14. The electronic moduleaccording to claim 12, wherein the epoxy forms a unified layer fasteningthe at least one glass-fibre mat and the at least one component in theelectronic module.